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1-Wire® and iButton® sponsored by Maxim Integrated Products, Inc. Description: 1-Wire® devices lower system cost and simplify design with an interface protocol that supplies control, signaling, and power over a single-wire connection.

Atheros AR5005 WLAN Chipset sponsored by Atheros Communications Description: AR5005 Wireless Chip Delivers High Performance and Low Power Consumption in a Small Form Factor Digital CMOS Design.

BCM3341 BroadVoice™ VoIP Broadband IC sponsored by Broadcom Corporation Description: The BroadVoice BCM3341 integrates seven commonly used, general-purpose chips into a single, efficient integrated circuit (IC) that reduces the size and power of the system while providing increased performance and better voice quality.

DC-DC Converter sponsored by Maxim Integrated Products, Inc. Description: It is pin compatible with the LT1613 and has lower ON-resistance (0.7 vs. 1) and lower quiescent supply current (200µA vs. 3mA).

DSF15 155 Mbps Data Service Framer sponsored by Galazar Networks Inc. Description: The DSF15 is a highly integrated Data Service Framer device capable of mapping Ethernet traffic into OC-3/STM-1 SONET/SDH transport payloads.

DSF250 2.5 Gbps Data Service Framer sponsored by Galazar Networks Inc. Description: The DSF250 is a highly integrated Data Service Framer device capable of mapping Datacom traffic into protected SONET/SDH transport payloads.

HyperTransport Cores sponsored by GDA Technologies Inc. Description: HyperTransport Technology is a high speed, low latency, and point-to-point link for interconnecting integrated circuits on board. It is a packet-based link implemented on two independent unidirectional sets of lines. Related Collateral: HyperTransport Host (Data Sheet) HyperTransport Cave (Data Sheet) HyperTransport Tunnel (Data Sheet) See All Collateral >>

Intel® High Definition Audio (Intel® HD Audio) sponsored by Intel Description: Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats.

Intel® IXF18102 10Gbps Physical Layer Device sponsored by Intel Description: The Intel® IXF18102 is a highly integrated framer solution for STS-192c/STM 64c port applications. The IXF18102 supports various modes of operation for transport of HDLC frames (POS) or Generic Framing Procedure (GFP) packet formatting.

Intel® IXF30005 Digital Wrapper 10Gbit/s OTN sponsored by Intel Description: The Intel® IXF30005 is a fully compliant G.709 digital wrapper device that covers most OTN applications on a single chip.

Line Receiver sponsored by Maxim Integrated Products, Inc. Description: This tiny receiver is deal for minimizing power, EMI, and bit-error rates in the next-generation clock/data distribution networks of cellphone base stations, central office switches, networking switches/routers, DSLAMs, and other communications equipment.

MDX250 Multiple 10/100/1000 Mbps Ethernet to SPI-3 Multi-PHY Mapper sponsored by Galazar Networks Inc. Description: MDX250 is a highly integrated multi-channel Ethernet controller for Ethernet over SONET/SDH applications.

MDX251 Fibre Channel / ESCON / FICON GFP-T Mapper sponsored by Galazar Networks Inc. Description: MDX251 is a multi-channel GFP-T mapper for Storage Area Networking protocols.

MSF 250 2.5 Gbps Multi-Service Framer sponsored by Galazar Networks Inc. Description: The MSF250 is a highly integrated Multi-Service Framer device capable of mapping both Telecom and Datacom traffic into protected SONET/SDH transport payloads.

MSF15 155 Mbps Multi-Service Framer sponsored by Galazar Networks Inc. Description: The MSF15 is a highly integrated Multi-Service Framer device capable of mapping both Telecom and Datacom traffic into protected OC-3/STM-1 SONET/SDH transport payloads.

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